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High Durability Precision Cnc Machined Components For Semiconductor Equipment

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High Durability Precision Cnc Machined Components For Semiconductor Equipment

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Brand Name : Yiding

Certification : ISO9001:2015; Rhos

Place of Origin : Guanddong, China

MOQ : 1

Payment Terms : L/C,D/A,D/P,T/T,Western Union,MoneyGram

Material Options : Stainless Steel (304, 316), Aluminum Alloys (6061, 7075), Tool Steel, Titanium, Engineering Plastics (POM, PTFE, Peek)

Processing Methods : CNC Turning, CNC Milling, Grinding, Wire EDM, Drilling, Tapping

Tolerance Capability : General ±0.01mm; High Precision up to ±0.005mm

Surface Finishing : Anodizing, Electropolishing, Nickel Plating, Passivation, Black Oxide, Sandblasting

Heat Treatment : Quenching, Tempering, Annealing, Stress Relieving (as required)

Inspection & Quality Control : 100% inspection before shipment; CMM (Coordinate Measuring Machine), Surface Roughness Tester, Hardness Testing

Certification Available : ISO 9001, Material Certificate, RoHS/REACH Compliance, COC (Certificate of Conformance)

Applications : Semiconductor Inspection Systems, Wafer Testing Equipment, Probe Stations, Alignment Fixtures, Precision Holders

Prototyping & Production : Rapid Prototyping, Small Batch Production, Large Volume Production

Lead Time : 5–20 working days depending on order volume and complexity

Packaging : Foam, Anti-static Blister Tray, Vacuum Packing, Carton, Pallet – as per customer requirements

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High Precision CNC Machining Part for Semiconductor Packaging Equipment
Product Specifications
Attribute Value
Material Options Stainless Steel (304, 316), Aluminum Alloys (6061, 7075), Tool Steel, Titanium, Engineering Plastics (POM, PTFE, Peek)
Processing Methods CNC Turning, CNC Milling, Grinding, Wire EDM, Drilling, Tapping
Tolerance Capability General ±0.01mm; High Precision up to ±0.005mm
Surface Finishing Anodizing, Electropolishing, Nickel Plating, Passivation, Black Oxide, Sandblasting
Heat Treatment Quenching, Tempering, Annealing, Stress Relieving (as required)
Inspection & Quality Control 100% inspection before shipment; CMM (Coordinate Measuring Machine), Surface Roughness Tester, Hardness Testing
Certification Available ISO 9001, Material Certificate, RoHS/REACH Compliance, COC (Certificate of Conformance)
Applications Semiconductor Inspection Systems, Wafer Testing Equipment, Probe Stations, Alignment Fixtures, Precision Holders
Prototyping & Production Rapid Prototyping, Small Batch Production, Large Volume Production
Lead Time 5–20 working days depending on order volume and complexity
Packaging Foam, Anti-static Blister Tray, Vacuum Packing, Carton, Pallet – as per customer requirements
Product Description
Semiconductor production demands specialized CNC machined parts for wafer manufacturing, oxidation, photolithography, etching, and inspection processes. These components vary in complexity, size, and materials, requiring expert CNC machining knowledge for proper fabrication.
Key Considerations for Semiconductor CNC Machining
  • Precision is paramount: High-level semiconductor manufacturing requires super-precise components for uniform chemical application and electrical property inspection. Special high-speed, high-precision machining solutions optimize workpiece quality.
  • Material expertise: Semiconductor components utilize various non-metal materials including ceramics, quartz, polyurethane, and silicone carbide, each presenting unique machining challenges at tight tolerances.
  • Process optimization: Complex geometries like semiconductor chamber housings require machining strategies that minimize multiple part setups to maintain vacuum sealing while maximizing precision and productivity.

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